The Shanghai Stock Exchange debt market has issued 142.8 billion yuan worth of science and technology innovation bonds this year, a year-on-year increase of 83%.

As of March 30, the Shanghai Stock Exchange bond market has issued a total of 154 technology innovation bonds with a total amount of 142.8 billion yuan this year, representing an 83% increase compared to the previous year. In terms of issuers, there are high-tech companies such as China Electronics, Huawei Technologies, as well as science and technology investment institutions such as Sinopec Capital. In terms of maturity, the technology innovation bonds are all medium-to-long term bonds, with 8 companies issuing 10-year long-term technology innovation bonds totaling 8.31 billion yuan, effectively matching the production, research and development, and investment cycles. In terms of the use of funds raised, the technology innovation bonds are intended to focus on areas such as next-generation information technology, new materials, high-end equipment manufacturing, and new energy.