Institution: Wafer foundry and packaging testing costs rise in sync, DDIC suppliers are preparing to raise prices.

According to the latest survey by TrendForce, due to the gradual increase in the cost of semiconductor wafer foundry and back-end packaging testing starting from 2025, as well as the continuous rise in the prices of precious metals raw materials, the cost pressure on display driver IC manufacturers has increased. Some companies have recently started communicating with panel customers to evaluate the possibility of increasing prices.