Moore Threads and China Mobile Research Institute jointly release a 128-core high-density super node reference design.

Recently, relying on the OISA collaborative innovation platform, industrial partners such as Moore Threads, China Mobile Research Institute, and Zhejiang Laboratory officially released the "OISA High-Density Super Node Reference Design Technical Specification". This specification addresses the current interconnection bottleneck, power supply pressure, and heat dissipation limits faced by smart computing centers, proposing a full-stack solution that lays the key technical foundation for building autonomous, controllable, high-performance smart computing clusters. In the physical layout and logical topology of the smart computing center, the OISA high-density super node restructures the depth of spatial density and expansion dimensions, breaking through the barriers to computing power growth of traditional architectures. The technical specification boldly introduces a large-sized high-density cable solution, achieving full interconnection of 128 cards within a standard single-width rack, based on mainstream 32-card to 64-card interconnection, and supporting deployment of 256 cards through parallel rack expansion, greatly optimizing computing power output per unit land area.