The chip design seminar for OpenClaw applications will be held in Beijing on Yizhuang.

According to the "Beijing Yizhuang" public account, the chip design seminar for OpenClaw applications is about to begin. This seminar is jointly organized by the Zhongguancun High-Performance Chip Interconnection Technology Alliance, Beijing Xinli Technology Innovation Center Co., Ltd., Beijing Yimo Integrated Circuit Excellence Engineer Innovation Research Institute, and co-sponsored by Beijing Qingyun Technology Co., Ltd. It brings together top industry wisdom to address the core pain points of OpenClaw application landing, and to build a communication platform for the deep integration of AI Agents and the chip industry. The seminar will be held on March 21, 2026, from 13:30 to 17:30, on the 1st floor of Building D at the Beijing Integrated Circuit Production-Education-Fusion Base in the Beijing Economic and Technological Development Zone.