Fisilicon: The 2.5T computing power chip for customers has been developed and is expected to be mass-produced in Q2. The next AI glasses product is expected to be launched in August.

Fuhanwei stated at the analyst meeting that the company's new products in 2026 include AIISP chips, edge-side chips, and AIoT chips. The progress of end-side AI products is as follows: 1. The chip with the largest capacity is expected to be released in March with relatively low computing power; 2. The 5T computing power chip has been developed by customers and is expected to be mass-produced in Q2, mainly used in XVR, high-end AI front-end cameras, and NAS; 3. A chip with even greater computing power is expected to begin sampling in Q3. The company has an AI glasses product, and some customers will gradually begin mass production this year; the next AI glasses product is expected to be launched in August.