Organization: It is estimated that the penetration rate of CPO in AI data center optical communication modules will grow annually, with a chance to reach 35% by 2030.

According to the latest high-speed interconnect market research by TrendForce, NVIDIA's next-generation AI computing cabinet architecture shows that the future focus of GPU design will shift towards higher-density chip interconnects and faster data transmission. Chip-to-chip interconnects within cabinets and large-scale interconnects across cabinets will become core issues in planning data centers. Traditional electrical transmission solutions using copper cables are unable to meet the demands of transporting data on a very large scale due to physical limitations, creating opportunities for the development of optical transmission solutions. TrendForce estimates that the penetration rate of CPO in AI data center optical communication modules will grow year by year, with the potential to reach 35% by 2030.