Xingchen Technology: Plans to release 1 laser radar chip and 3 12nm chips in 2026.

Xingchen Technology announced the Investor Relations Activity Record Form, planning to release 1 vehicle-mounted LiDAR chip and 3 12nm chips in 2026, all targeting the mid-to-high-end, high-profit area. The first main LiDAR chip is expected to be mounted and produced in small quantities in Q2 of 2026, with the second chip focusing on vehicle-mounted blind spot scenarios, with the number of chips per vehicle increasing several times compared to the main LiDAR, and can also be expanded to applications in robots, intelligent wearables, mobile imaging, low-altitude economic devices, etc., planned to be released in Q4 of 2026. Smart robot and edge computing chips support flexible configuration of tens to hundreds of T-level computing power, suitable for AI large model multi-modal reasoning and edge computing scene requirements; advanced driving and intelligent cockpit chips integrate 32T computing power, have obtained designated points from international first-line OEMs, and are planned to be mass-produced in Q1 of 2027. The second generation AI glasses chip adopts a 12nm process and a new generation motion ISP, with lower power consumption and cost optimization. The company also disclosed that as of the end of 2025, 2025 was a key year for the rapid penetration of AI at the edge, and as of the end of the reporting period, the company's SoC with AI computing power has shipped over 550 million units, with annual shipments exceeding 120 million units.