Huatian New Materials: has laid out advanced adhesive products for packaging such as HBM and Chiplet, and related products have been sent to customers for sampling and testing.

On March 6, Huitian New Materials stated on an interactive platform that the company has laid out advanced adhesive products for HBM, Chiplet and other packaging, and relevant products have been sent to customers for sampling and testing. The company will continue to focus on the high-end electronic adhesive field and actively seize opportunities for industry development.