Report: SK hynix is exploring new HBM4 packaging technology.

According to a report by ZDNet on Tuesday cited by TechNews, industry insiders revealed that SK hynix is advancing a packaging architecture improvement plan. The core measures include increasing the thickness of the DRAM chip and reducing the distance between DRAM layers. Currently, this technology is in the verification stage. If successfully commercialized, this plan is expected to help SK hynix achieve the top performance indicators set by NVIDIA for the sixth generation HBM4, and lay a foundation for performance improvements in future products.