Chengtian Great Business: Currently, the company is actively promoting copper needle-type heat dissipation base plate products to top power module and tooling companies.

Chengtian Greatness stated on the interactive platform on March 3 that the company's semiconductor packaging materials are mainly used for power devices, covering the packaging needs of products such as MOSFET, IGBT, SiC, and power modules. Currently, the company is actively promoting copper pin heat sink base plate products to leading power module and fixture companies to meet the application needs in fields such as new energy vehicles and photovoltaic inverters. At the same time, the company is continuing research and validation work on next-generation advanced packaging heat dissipation materials such as microchannel packaging cover plates around the heat dissipation needs of high power density devices, and is collaborating with relevant customers to jointly develop and introduce applications.