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Lates News

date
17/02/2026
Wafer: The chip wafer plan under the expanded cooperation agreement is scheduled to start in mid-2026.
Latest
8 m ago
The yield on Japan's 5-year government bond fell by 1.5 basis points to 1.655%.
8 m ago
Former Bank of Japan board member Soshi Ando expected the central bank to raise interest rates in April.
11 m ago
It's so hot! 143 companies have already submitted applications for Hong Kong Stock Exchange IPOs this year.
15 m ago
Morgan Stanley: BHP's first-half earnings and dividends better than expected.
16 m ago
The Nikkei index fell by 0.3% due to the drag from technology stocks.
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