Shenghong Technology: The company is continuously advancing the research and certification of 10 to 30 layer HDI, and has the technical capabilities for PCB with more than 100 layers.

Shenghong Technology stated in the investor relations activity record that the company has a mass production capacity of high-precision circuit boards with 70 layers or more, making it one of the first in the world to achieve mass production of 6-stage 24-layer AI computing data center products, as well as an enterprise with the capability of 8-stage 28-layer HDI and 16-layer arbitrary interconnect HDI technology. Currently, the company is actively researching and certifying the development of 10-stage 30-layer HDI, and also has the ability for high multi-layer PCB technology of over 100 layers.