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23/01/2026
In after-hours trading, Intel's stock price fell 13% at the close, while AMD's stock price dropped 1.3%.
Latest
5 m ago
The Euro Stoxx 50 index futures fell by 0.2%, while the Germany DAX index futures fell by 0.3%.
5 m ago
The Trump administration is calling upon backup power for data centers before the snowstorm arrives.
6 m ago
The "Polar" icebreaker ship has fully launched a comprehensive survey of sea ice in Liaodong Bay.
8 m ago
Since 2026, the stock price of storage concept stock Sandisk has soared 112%, causing short sellers to lose up to $3 billion. With the surge in storage demand driven by artificial intelligence, there is an "extreme" risk of short squeeze.
8 m ago
CITIC Securities' research report states that the recent rise in silicon materials and silver prices has increased the pressure on the profits of photovoltaic cell and module companies. The shortage in supply and demand of silver has been present since 2019 and continues to this day. Considering the rigidity of silver supply and the emerging applications that require the use of silver, it is expected that the supply and demand of silver will remain tight in the long term. To control costs and reduce the consumption of silver has become a top priority for photovoltaic cell and module companies, with copper being the most ideal alternative material. Solving the issues of oxidation and diffusion of copper is crucial, but the PCB, MLCC, and semiconductor industries already have rich experience that the photovoltaic sector can reference. Currently, silver-coated copper and electroplated copper solutions are progressing relatively quickly in the photovoltaic industry. Pure copper paste is the ultimate goal, but there are still many issues that need to be resolved. Assuming that by 2026-2027, the penetration rates of silver-coated copper and copper paste will reach 17.7% and 43% respectively, with corresponding paste production of 813 and 2188 tons, this will bring significant performance flexibility for paste and metal powder companies.
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