SK Hynix and Samsung accelerate the commercialization process of HBM "Father of HBM": Fastest next year for use in Nvidia products.

Although it took nearly ten years for HBM to make its way onto the center stage of the semiconductor industry, its iterative technology HBF may achieve commercialization and popularization at a faster pace. It is reported that SK Hynix is collaborating with SanDisk to develop the HBF standard. The company plans to release HBF1 samples as early as this year, which are expected to be made up of 16 layers of NAND flash memory stacking. In addition, Professor Kim Jung-ho, known as the "father of HBM" at the Korea Institute of Science and Technology, revealed that "Samsung Electronics and SanDisk plan to implement HBF technology in actual products from NVIDIA, AMD, and Google as early as the end of 2027 or the beginning of 2028." He added, "Through the rich experience gained in the development of HBM, these experiences can be applied to HBF design. Therefore, the development speed of HBF technology will be faster." HBF, or High Bandwidth Flash, is a product made by stacking NAND flash memory, similar in structure to the HBM stacked DRAM chip. Kim Jong-ho believes that HBM and HBF are like a study room and a library. The former has a smaller capacity but is more convenient to use, while the latter has a larger capacity but also means higher latency.