The international standard for organic packaging substrates has been released, providing a global unified technical specification for advanced packaging.

On January 15, the Global Electronics Association officially released the IPC-6921 "Requirements and Acceptance for Organic Packaging Substrates" standard. The standard was developed by 246 technical experts from the global industry chain upstream and downstream, and took three years to complete. Participants in the development of the standard include OEMs, OSATs, PCB manufacturers, raw material suppliers, and third-party testing organizations. The standard systematically specifies the product identification, performance requirements, and acceptance criteria for organic packaging substrates, providing a unified international technical specification for key applications such as artificial intelligence, high-performance computing, and automotive electronics.