The annual performance report of the "technology board" of the bond market is released, with the issuance scale of technology and innovation bonds exceeding 700 billion yuan in 2025.

The reporter learned that since the China Interbank Market Dealers Association launched technology innovation bonds and established a "technology board" on May 7, 2025, it has focused on six aspects of "expanding participants, broadening purposes, reducing disclosure, activating mechanisms, improving ratings, and enhancing credibility" to enhance the compatibility between the bond market and technological innovation. In 2025, the issuance volume of non-financial enterprise technology innovation bonds in the interbank market exceeded 700 billion yuan.