Hongda Electronics: the holding subsidiary plans to invest 1 billion yuan to establish a special device wafer manufacturing and packaging test base project.

Hongda Electronics announced that its holding subsidiary, Siwei Technology, plans to establish a subsidiary in the Wuxi High-tech Development Zone to carry out research, design, production, and packaging of semiconductor special devices and chips. In order to support the business operation, Siwei Technology plans to construct a special device wafer manufacturing and testing base, with a total planned investment of 1 billion RMB, to be implemented in two phases: the first phase from 2026 to 2028, with an estimated total investment of 300 million RMB, planning to lease a 10,400 square meter factory building at No. 98 Meiyu Road, Xingu District, Wuxi City to build a packaging and testing production line; the second phase will be to construct a semiconductor chip production line based on the actual investment situation of the first phase project and the future market development situation, planning to use about 30 acres of industrial land, with a total investment of 700 million RMB.