TrendForce: Rubin's wireless architecture and ASIC high HDI layer architecture drive the PCB industry to become the core of computing power.

According to the Zhitong Finance and Economics APP, the latest research from TrendForce shows that the design of AI servers is undergoing a structural transformation. From the cable-free architecture of NVIDIA's Rubin platform to the high-level HDI design of ASIC servers developed by cloud giants, PCBs are no longer just circuit carriers but have become the core layer for computing power release. PCBs have officially entered the "three highs era" of high frequency, high power consumption, and high density. The organization believes that 2026 will be a new starting point for PCBs driven by "technology content-driven value".