TSMC's Roger Luo: N3 has received around 100 NTOs expected to become a high-volume, long-running process node.

The 2025 Integrated Circuit Development Forum and the 31st Integrated Circuit Design Industry Exhibition were held today in Chengdu. TSMC General Manager Luo Zhenqiu said that 3nm is ultimately the best FinFET technology. He revealed that TSMC's N3E has achieved mass production of flagship mobile and HPC/AI products, N3P is scheduled to start production in the fourth quarter of 2024 to replace N3E. TSMC has provided a variety of N3 variants to meet specific application needs, with N3X targeting client CPUs, N3A targeting the automotive sector, and N3C targeting value-level products. N3 is expected to become a high-volume, long-term operating process node, with about 100 NTAs obtained by September 2025.