ASML showcases its first advanced packaging lithography tool with large field optics.

At the 8th China International Import Expo, semiconductor equipment supplier ASML showcased some of its panoramic lithography products and technologies. Among them, the DUV lithography machines include TWINSCAN XT:260 and TWINSCAN NXT:870B. According to reporters, the TWINSCAN XT:260 i-line lithography machine is ASML's first lithography system that can serve the advanced packaging field, with a large field of view exposure that can improve production efficiency by 4 times compared to existing models; TWINSCAN NXT:870B, supported by upgraded optical devices and the latest generation of magnetic levitation platform, can achieve a wafer production rate of over 400 pieces per hour.