Jingsheng Electromechanical releases a full process solution for square silicon wafers.

On November 7, Jingcheng Electromechanical officially released a full-process solution for square silicon wafers, which provides a complete set of self-developed equipment for crystal growth, truncation, squaring, grinding, slicing, chamfering, polishing, and cleaning. As AI chips become larger and more complex in design, the area utilization and packaging efficiency of traditional circular wafers are gradually limited, leading to the trend of "square replacing circle." Chips are arranged on rectangular substrates to achieve more chip integration. Currently, the advanced packaging revolution from CoWoS to CoPoS has begun, which is expected to drive the formation of larger-scale end-demand through the updating and iteration of supply-side products, greatly alleviating the reality of advanced packaging capacity exceeding demand.