Debt market's "technology board" launched for half a year, with the issuance scale reaching 1.38 trillion yuan.

On November 7th, the "technology board" in the bond market officially landed for half a year, and funds are flowing faster into the field of science and technology innovation. According to Wind Information data, from May 7, 2025 to November 6, the technology innovation bond market showed a strong growth trend, with a total of 1186 issuances, accounting for 77% of the total issuances of the year; the issuance scale reached 1.38 trillion yuan, accounting for 81% of the total issuance scale of the year. "The issuance scale of the primary market for technology innovation bonds has hit a new high for the year, the secondary market trading activity and pricing efficiency have improved simultaneously, and institutional allocation demand continues to strengthen." Yin Ruizhe, chief fixed income analyst at Guojin Securities, told reporters that the current technology innovation bond market is showing the characteristics of "rising volume and price, and optimal structure", becoming an important financial tool to support high-quality development of technology innovation and the real economy.