Eason Technology: Yangtze Storage is a customer of the company. The product can be applied to HBM memory chip packaging.

Eisen Corporation stated on the interactive platform that SMIC and Yangtze Memory Technologies are the company's customers. The company's products, such as "Advanced Packaging Photoresist", "Copper Plating Solution", "Copper Etching Solution", and "Tin-Silver Addition Agent for Electroplating", can be used for HBM memory chip packaging.