PRODUCTIVE TECH (00650) Secures Orders for 29 New Equipment Units, Including Single-Wafer Cleaning Equipment and Furnace LPCVD Equipment

PRODUCTIVE TECH (00650) announced that, as its various semiconductor equipment platforms continue to be delivered to customers and pass verification, the Company has accumulated extensive mass-production experience and gained industry recognition, thereby putting the Company in a favorable position to secure larger-volume formal orders. Since the date of that announcement, the Company has obtained orders for a total of 29 new equipment units, of which 14 are new orders for semiconductor equipment, including single-wafer cleaning equipment and furnace LPCVD equipment. These equipment systems are mainly used in customers' high-end specialty process semiconductor and third-generation semiconductor production lines, covering wafer front-end and back-end process applications. In descending order by number of units: 1) OCTOPUS and OCTOPUS-SP single-wafer cleaning equipment, used for 12-inch wafer backside cleaning, Solvent cleaning, RCA cleaning and other processes, including four sulfuric acid cleaning equipment units; 2) CUBE single-wafer cleaning equipment, used for backside cleaning and etching processes; and 3) Furnace LPCVD equipment, used for 12-inch SiN thin-film deposition processes. These equipment orders are all formal orders, and revenue has not yet been recognized. The Company will recognize revenue after customers pass verification. The Company's independently developed semiconductor cleaning and furnace LPCVD/ALD equipment platforms can cover mature processes as well as advanced logic and memory processes, with technical performance benchmarked against leading international equipment manufacturers and industry-leading equipment productivity. Among them, the semiconductor cleaning equipment series platform, with single-wafer cleaning equipment as its core platform, covers mainstream wet cleaning applications in the industry such as Solvent cleaning, wafer backside cleaning, and RCA cleaning. At the same time, the Company has further broken through technical barriers and developed 190C advanced high-temperature sulfuric acid cleaning equipment, which has been successfully shipped. The Company's semiconductor furnace equipment platform has two major advanced equipment product lines, LPCVD and ALD, targeting critical thin-film deposition processes for 12-inch wafers such as SiN, Poly, and TEOS. In addition, the Company has completed the development of Low-K ALD SiOCN furnace equipment for high-performance dielectric thin-film deposition at the 14/7nm nodes, a niche segment currently still monopolized by overseas equipment suppliers. In the future, the Company will continue to leverage its technological advantages and actively expand its market, with the aim of obtaining more batch formal orders and bringing in more industry-leading customers, so as to drive rapid growth in its semiconductor equipment business, improve business gross margins, and promote the Company's sustained organic development.