Brokerage Morning Meeting Highlights | The Next Potential Market After Moving from Chat to Work AI Coding
CITIC Construction Investment believes that the next potential market after AI Coding is moving from Chat to Work; Huatai Securities suggests paying attention to the actual delivery situation of humanoid robots, transitioning from exhibits to products; China International Capital Corporation (CICC) believes that with AI advanced packaging new materials, attention should be paid to the core equipment ramp-up.
Yesterday, the market experienced a fluctuating rise, with all three major indices climbing over 1%, and the Sci-Tech Innovation 50 Index increasing by more than 3.5%. The total transaction value in the Shanghai and Shenzhen stock markets reached 2.13 trillion yuan. In terms of sectors, concepts such as storage chips, PCBs, CPOs, optical fibers, and gold performed actively. On the downside, the power grid equipment sector showed signs of weakening. By the close, the Shanghai Composite Index rose by 1.13%, the Shenzhen Component Index increased by 1.5%, and the ChiNext Index grew by 1.71%.
China Securities Co., Ltd. believes that the next potential market after AI Coding is shifting from Chat to Work; Huatai suggests focusing on the real delivery status of humanoid Siasun Robot & Automation as it transitions from exhibit to product; CICC emphasizes that in AI advanced packaging new materials, attention should be paid to the core equipment expansion.
China Securities Co., Ltd.: Shifting from Chat to Work, the next potential market after AI Coding
Global large models and major internet companies are actively laying out their strategies. Earlier this year, Anthropic took the lead in launching Claude Cowork, alongside Claude Code. In July, OpenAI integrated Codex with ChatGPT, allowing users in simple chat scenarios to expand into complex multi-task office environments. Recently, xAI released Grok Bot. Major domestic companies are also strategically focused: Tencent took the lead in March by launching WorkBuddy, gaining a first-mover advantage; Alibaba integrated three products to launch Qianwen Office; ByteDance incorporated Feishu into Doubao, officially launching the Doubao work brand. Looking ahead, office applications are expected to become the next round of platform-level B-end products and new traffic entry points.
Huatai: From Exhibit to Product, Suggesting Attention to the Real Delivery Status of Humanoid Siasun Robot & Automation
The output of Siasun Robot & Automation is expected to exceed 40,000 units in the first half of 2026 and break through 100,000 units for the whole year (according to the Ministry of Industry and Information Technology standards). In the first seven months, the sector saw over 100 billion yuan in financing, with Yushu Technology's stock surging 460.34% on its first day of trading. The financing and valuation channels for leading companies are beginning to open up. A full breakout still requires waiting for a critical point. The standard set by Yushu's Wang Xingxing is "two 80%": Siasun Robot & Automation should be able to complete about 80% of tasks through voice or text commands in 80% of unfamiliar scenarios, with a timeframe ranging from 2-3 years at best to 5-10 years at worst. Strategic areas to focus on include: leading OEMs and first-tier suppliers with real delivery capabilities; data collection, simulation, and training infrastructure; components with high value that are not yet finalized, such as dexterous hands and tactile sensors, as well as companies with market share and cost advantages in established components like joints and actuators; categories such as four-legged, patrol, and consumer-level robots that have already achieved scalable sales.
CICC: AI Advanced Packaging New Materials, Attention on Core Equipment Expansion
Leading manufacturers such as TSMC and Intel are accelerating the verification of glass substrates for next-generation advanced packaging: By June 2026, TSMC will complete a pilot line for approximately 310310mm panels, and collaborate with Yifeng and Innolux for three-party validation of CoWoS glass substrates; in July 2026, Intel will partner with Lens Technology to develop glass packaging technology. With the upgrade of AI large chip packaging dimensions, glass substrates are expected to become an important materials platform for next-generation advanced packaging, and relevant core equipment segments are likely to benefit first.
This article is reproduced from "Cailian Press," edited by Liu Jiayin.
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UNISOUND (09678) released its interim results, with revenue increasing by 38.7% year-on-year to 562 million yuan, and the commercialization capability of large model technology further enhanced.

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