New Stock News | Ingenic Semiconductor (03223) concludes its public offering with the total subscription amount reaching HKD 222.01 billion, oversubscribed by 689.3 times.
The "Storage + Computing + Simulation" chip provider Junzheng Co., Ltd. (03223) held its IPO from August 17, 2026, to August 20, 2026, and the offering has now concluded.
The "Storage + Computing + Simulation" chip provider Ingenic Semiconductor (03223) conducted its IPO from August 17 to August 20, 2026, which has now concluded. According to market sources, as of 11 a.m. on August 20, Ingenic Semiconductor has borrowed HKD 222.01 billion in margin from brokers, resulting in an oversubscription of 689.3 times against the public offering fundraising amount of HKD 322 million.
Ingenic Semiconductor plans to issue 31.287 million H shares, with approximately 10% allocated for public offering and about 90% for placement, along with a 15% overallotment option. The maximum offering price per share is HKD 102.8, with a minimum investment of 100 shares, leading to an entry cost of HKD 10,383.7. The company expects to be listed and traded on the Hong Kong Stock Exchange on August 25 (Tuesday), with GUOTAI JUNAN I as its exclusive sponsor.
The prospectus indicates that Ingenic Semiconductor is a "Storage + Computing + Simulation" chip provider, with products widely used in automotive electronics, industrial medical applications, as well as AIoT and smart security devices. The company has developed storage chips primarily used in automotive electronics and industrial medical fields (including DRAM, SRAM, NOR Flash, and NAND Flash), computing chips for AIoT and security, and analog chips for automotive electronics, industrial applications, and home appliances (including LED driver chips and combo chips). The companys products meet automotive-grade and industrial-grade standards, characterized by high quality, high reliability, low energy consumption, and long product life. In the first quarter of 2026, the revenue proportions for storage chips, computing chips, and analog chips were 65.3%, 25.8%, and 8.5%, respectively.
In 2023, 2024, and 2025, as well as for the three months ending on March 31, 2026, the companys R&D expenditures were RMB 708.3 million, RMB 681.3 million, RMB 712 million, and RMB 171.9 million, accounting for 15.6%, 16.2%, 15.0%, and 11.0% of the company's respective total revenues for those years/periods.
The company has entered into cornerstone investment agreements with Emerald Prime, GF Fund, Perseverance Asset Management, Shanghai Gao Yi, and Huatai Capital Investment (related to Huatai back-to-back Total Return Swaps and Huatai client Total Return Swaps), as well as Singapore Huagin, ICBC Wealth Management, Arrow Target, Huitianfu (Hong Kong), Singularity Asset, Heading Pioneer 10 Fund LPF, Dreamee HK Fund, under which the cornerstone investors have agreed to subscribe or procure designated entities to subscribe for the relevant number of offered shares (rounded down to the nearest complete trading unit of 100 H shares) at the offering price, amounting to approximately USD 192 million.
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