New stock news: Lontium Semiconductor Corporation's Hong Kong IPO prospectus is invalid.

Lontium Semiconductor Corporation (referred to as Lontium Semiconductor Corporation) submitted its Hong Kong IPO prospectus on December 22, 2025, which was valid for 6 months and expired on June 22, 2026. At the time of submission, China Securities Co., Ltd. International acted as its exclusive sponsor. According to the prospectus, Lontium Semiconductor Corporation is a leading high-speed mixed-signal chip design company, committed to building efficient and reliable "data highways" for smart terminals, devices, and AI applications. The company's products enable seamless data transmission and processing, and efficient interaction between computing, storage, and display units. The company's applications include smart visual terminals, smart in-vehicle systems, AR/VR devices, and AI and High-Performance Computing (HPC). According to Frost & Sullivan data, based on revenue in 2024, the company ranks first in mainland China and among the top five fabless design companies globally in the video bridging chip market. For nearly twenty years, the company has continuously innovated and conducted research and development in these core technologies: seamless, high-speed, and stable transmission for Siasun Robot & Automation and drones, AR/VR devices, autonomous driving systems, and high-performance computing systems rely on three basic technological pillars: (i) high-bandwidth SerDes technology; (ii) high-speed protocol processing, data encryption technology; and (iii) high-definition video processing and display driver technology. Building on its technological advantages in high-bandwidth SerDes, Lontium Semiconductor Corporation has expanded into a broader field of interconnect chips. The company focuses on the development of key interconnect components such as PCIe/CXL/USB Retimer and Switch. To meet the increasing demand for HPC and AI, the company's solutions address the growing bottleneck of multi-modal data transmission in increasingly complex computing environments, including vertical expansion architectures (within GPU clusters), horizontal expansion architectures (data centers), and cross-system architectures (between data centers). The company's solutions are designed to meet the strict requirements of the next-generation AI infrastructure and HPC systems for ultra-low latency, ultra-high bandwidth, and high-reliability interconnections.