US Stock Market Move | Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR (TSM.US) rose more than 4%, indicating that prices for 3nm processes are expected to increase by 15% in the second half of the year.
On Wednesday, TSMC (TSM.US) rose more than 4% to $429.40.
On Wednesday, Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR (TSM.US) rose over 4% to $429.40. According to sources, Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR plans to once again raise its 3-nanometer process wafer foundry prices in the second half of 2026, with the increase potentially reaching 15%. In 2027, there may be a further increase of 5% to 10%.
It is reported that at the shareholders' meeting on June 4th, Wei Zhejia, Chairman and CEO of Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR, will formally explain the rationale for the price increase. This could be a key window for global semiconductor investors to assess the sustainability of AI demand, the supply structure of advanced processes, and the pricing power boundaries of Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR in the long term.
Related Articles
A new "small retail investor tycoon" emerges! A post has sparked X-Fab Silicon Foundries, a small European chip manufacturer, to skyrocket by over 70%.
737 MAX production achieves a key breakthrough as Boeing Company (BA.US) plans to increase monthly production to 47 aircraft within a few months.
US Stock Market Move | Target Corporation (TGT.US) rose more than 4% as first-quarter results exceeded expectations and full-year guidance was raised.
A new "small retail investor tycoon" emerges! A post has sparked X-Fab Silicon Foundries, a small European chip manufacturer, to skyrocket by over 70%.
737 MAX production achieves a key breakthrough as Boeing Company (BA.US) plans to increase monthly production to 47 aircraft within a few months.
US Stock Market Move | Target Corporation (TGT.US) rose more than 4% as first-quarter results exceeded expectations and full-year guidance was raised.
