ROBOSENSE (02498) releases its chip strategy, with SPAD-SoC technology leading the generation and mass production delivery within the year.

On April 21st, RoboSense (02498) held the 2026 Tech Day in Shenzhen, where the company unveiled its chip strategic evolution roadmap and technological achievements for the first time. Two flagship SPAD-SoCs based on the new "Genesis" digital architecture made their debut at the event: the Phoenix series, positioned as a single-chip native ultra-high line count, and the Peacock series, positioned as a solid-state high-resolution super-large array. Both chips achieved industry-leading intergenerational levels and will enter mass production by 2026. The Phoenix chip is the world's first single-chip integrated SPAD-SoC with 2160 lines for automotive-grade applications, surpassing 4 million pixels in point cloud granularity, exceeding that of a 4 MP camera. The Peacock chip is the industry's highest-spec solid-state array SPAD-SoC that can be mass-produced, integrating a 640x480 high-density SPAD array to achieve VGA-level 3D perception. CEO Chunchao Qiu stated at the Tech Day event, "Digitization forms the foundation, image direction, and chip define the future. The future of 3D perception is a new era of image-oriented, strong chip capabilities, and overall system value. RoboSense's goal is not just to be a participant in this era, but to be the pioneer of the 3D perception new era." Genesis Architecture: Systematic Output of Chip Technology Accumulation The newly released Genesis digital architecture is named Eocene. It is a SPAD-SoC chip platform that can evolve rapidly and iteratively. The architecture covers various fields such as automotive, Siasun Robot & Automation, industrial, and consumer electronics, continuously incubating a differentiated chip family. The architecture consists of four layers. The base process layer uses a 28nm automotive process, reducing the core area by 40% and power consumption by 30%. The third-generation ultra-sensitive SPAD photosensitive layer has the world's highest photon detection efficiency of 45%. The second-generation 3D stacking process ensures lower noise performance. The core computing layer is equipped with a 4320-core heterogeneous computing array, supporting 4.95 trillion point cloud sampling and processing per second. The high-bandwidth on-chip data highway provides computational support for pixel perception in the tens of millions. The algorithm acceleration layer integrates anti-interference engines, improving sunlight noise and anti-cross-interference capabilities to 99.9%. The safety and reliability layer features an ASIL B functional safety architecture to ensure stable chip operation in extreme environments of -40C to 125C. Based on the Genesis architecture, RoboSense has achieved "high pixels do not equal high costs" commercial deployment. Leading technological advantages solidify into continuous chip-level generational differences. Phoenix and Peacock: Both Array and Array Breakthroughs, Establishing Technological Differences The Phoenix chip adopts a single-chip, single-optical path design with 2160 native receiving channels. It can output a point cloud resolution of 2160x1900, surpassing 4 million pixels in granularity, similar to a camera. In terms of performance, the Phoenix has a native 2160 lines and can detect up to 600 meters. It can clearly see a 13x17cm box 150 meters away, surpassing the industry's mainstream small target detection capability. The Phoenix series offers five models, supporting laser radar product designs from 2160 lines to 240 lines. Currently, the 4 million pixel laser radar solution based on the Phoenix chip has been selected by top automotive companies and will enter mass production by 2026. The Peacock chip integrates a 640x480 high-density SPAD array, achieving VGA-level resolution and outputting dense and delicate three-dimensional depth images. It has a maximum field of view of 180x135, with an ultra-wide angle. It can detect objects at distances less than 5 cm, achieving zero blind spots in close proximity. The frame rate is 10-30Hz, aligned for the first time with camera frame rates. The chip incorporates high-precision TDC and ranging processing engines, improving detection accuracy by six times compared to the previous generation. The Peacock chip enters three major scenarios with rich three-dimensional visual information: automotive solid-state fill-flash, Siasun Robot & Automation standardized visual module, and a new integrated sensor form factor. At the event, Qiu announced that the Peacock chip will be "available upon release" and will be mass-produced in the third quarter of 2026. Currently, products based on this chip have been delivered in small quantities to customers. Moving towards Colorful Three-dimensional Vision: Grounding in 2027 RoboSense's exploration in the field of integrated sensors continues to deepen. The AC1 and AC2 active camera series launched in 2025 have provided the industry with diverse integration solutions. At the end of the presentation, Qiu showcased a 2K near-infrared image directly captured and scanned in real-time by the Phoenix chip, with grayscale information and three-dimensional distance information synchronously output at a resolution of 2160x1900. Qiu stated at the conference, "This is probably the first time in human history that a 2K image captured by a SPAD chip has been displayed." Currently, the RoboSense Active Camera platform still follows the technology route of integrating high-resolution CMOS with self-developed SPAD. As a closing announcement, the company declared that a true RGBD sensor will be officially launched by the end of 2027. At that time, SPAD is expected to replicate the glory of CMOS, giving rise to a new super sensor form factor and market application. Realization of Generational Superiority From securing top automotive companies for the Phoenix to delivering small quantities of peacock chips to customers, RoboSense's chip strategy has entered a growth spiral of mass delivery. The two chips cover the two mainstream chip forms of ultra-high line arrays and solid-array arrays, simultaneously expanding the technological advantages in the automotive and Siasun Robot & Automation industries. RoboSense stated that over the past few decades, CMOS has made cameras ubiquitous. In the coming decades, RoboSense will push 3D perception into an era as ubiquitous as cameras, stepping into every vehicle, every Siasun Robot & Automation, and every physical AI terminal.