HK Stock Market Move | ASMPT (00522) rose more than 5%. JP Morgan predicts that the company will increase TCB equipment's long-term total potential market size expectations.

ASMPT (00522) rose more than 5%, as of the time of writing, it rose by 5.53%, to 110.7 Hong Kong dollars, with a turnover of 89.4897 million Hong Kong dollars. On the news front, JP Morgan previously released a research report pointing out that based on the strong capital expenditure trend in the advanced logic packaging field, as well as preliminary signs of improvement in the mainstream outsourced semiconductor packaging and testing (OSAT) market, the bank has included ASMPT in its list of positive catalyst observations. At the same time, the bank has raised the company's earnings per share forecasts for the financial years 2026 and 2027 by 7% and 15% respectively. JP Morgan expects ASMPT to raise its long-term total potential market size expectations for its thermal compression bonding (TCB) equipment, and to show confidence in gaining more market share in that market. At the same time, the company will provide more progress in the high-frequency wide memory (HBM) thermal compression bonding market, and point out that the capital expenditure environment for the Chinese market and mainstream outsourced semiconductor packaging and testing manufacturers is becoming more favorable.