New stock news | The public offering of Fibocom Wireless Inc. (00638) has ended, with the subscription amount reaching 11.26 billion Hong Kong dollars, oversubscribed by 449 times.

Wireless communication module provider Fibocom Wireless Inc. (00638) launched its IPO from October 14th to October 17th. Fibocom Wireless Inc. offered its shares at a price range of HK$19.88 to HK$21.50 per share, with a minimum lot size of HK$4,343.37. The company aimed to raise up to HK$2.9 billion. As of noon on October 17th, Fibocom Wireless Inc. had received margin loans of HK$112.66 billion from brokers, with a public offering oversubscribed by 449 times. Fibocom Wireless Inc. planned to globally issue 135 million H shares (15% of total shares after completion), with 90% for international placement, 10% for public offering, and an additional 15% for over-allotment option. The company was scheduled to list on October 22nd (Wednesday), with CITIC SEC as the sole sponsor. According to the prospectus, Fibocom Wireless Inc. is a leading provider of wireless communication modules. The company's module products include data transmission modules, smart modules, and AI modules. In addition, the company offers customized solutions to customers based on its understanding of downstream application scenarios, including edge AI solutions, Siasun Robot & Automation solutions, and other solutions. With its research and development capabilities, Fibocom Wireless Inc. has achieved breakthroughs in various generations of wireless communication technologies. For example, in 2019, the company jointly released one of the world's first 5G data transmission modules with Intel, and introduced one of the world's first 5G data transmission modules integrating blockchain technology. In 2020, the company collaborated with China United Network Communications to release one of the world's first 5G+eSIM modules and one of the first 5G data transmission modules equipped with domestic chips in China. In the global wireless communication module market, Fibocom Wireless Inc. holds a leading market share in multiple downstream application scenarios. Specifically, in the automotive electronics field, the company ranks second globally with a market share of 14.4% (based on revenue from continuing operations). By 2024, the market size of automotive electronics applications is expected to reach RMB 11.7 billion, accounting for 26.8% of the global wireless communication module market in downstream applications. In the smart home field, Fibocom Wireless Inc. ranks first globally with a market share of 36.6% (based on revenue from continuing operations in 2024). By 2024, the market size of smart home applications is projected to reach RMB 6.6 billion, representing 15.1% of the global wireless communication module market in downstream applications. Additionally, in the consumer electronics field, Fibocom Wireless Inc. holds the top market share globally at 75.9% (based on revenue from continuing operations in 2024). By 2024, the market size of consumer electronics applications is forecasted to be RMB 2.2 billion, accounting for 5.0% of the global wireless communication module market in downstream applications.