HK Stock Market Move | Circuit Fabology Microelectronics Equipment (09630) increased by more than 6% recently, as its self-developed PLP 2000 equipment successfully obtained an important customer order in the advanced packaging field.
Chipbond Technology Corporation (09630) has risen by over 6%, as of the time of drafting, it has increased by 6.35%, to 432 Hong Kong dollars, with a trading volume of 49.1637 million Hong Kong dollars.
Circuit Fabology Microelectronics Equipment (09630) rose more than 6%, as of the time of drafting, it rose 6.35%, reaching 432 Hong Kong dollars, with a transaction amount of 491.637 million Hong Kong dollars.
On the news front, according to the official WeChat account of Circuit Fabology Microelectronics Equipment, recently, the company's domestically developed first 510515mm panel-level packaging direct writing lithography equipment PLP 2000 successfully obtained important customer orders in the advanced packaging field. Soochow pointed out that the PLP 2000 supports processing of up to 600600mm large panels, meeting the production process requirements of CoPoS, FOPLP, and 2m glass substrate packaging, filling the gap in key equipment for domestic advanced packaging lithography, marking the company's realization of commercial breakthrough in the second growth curve of the semiconductor industry.
Soochow believes that Circuit Fabology Microelectronics Equipment leverages its high-precision lithography core capabilities to enter the PCB and IC carrier board fields, forming a technological advantage. At the same time, the company's layout of advanced packaging equipment is a technological extension of its lithography main business, serving as a strategic layout to return to the semiconductor origins, with all packaging lithography equipment reusing the LDI underlying technology platform, compatible with mainstream advanced packaging processes such as COPOS and FOPLP. By leveraging a unified semiconductor lithography technology base, the company achieves dual-wheel drive of the PCB basic plate and the advanced packaging second curve, representing a core target of capital expenditure benefiting deeply from the AI industry chain.
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